Backed by our own SMT manufacturing base, we use SMT + COB hybrid processes to deliver full-cycle PCBA OEM services — from component sourcing and assembly to packaging and testing — across optical modules, RF modules, wearables and other custom electronic modules.
Our product structure is organized by application. Top-level categories map to business direction; sub-categories map to specific module types — so you can quickly find the right product and process fit.
Optical transceiver PCBA and precision device packaging covering 10G to 1.6T optical communication scenarios.
RF and processing platforms, Wi-Fi, Bluetooth, GPS and mmWave radar modules for high-precision, compact designs.
Laser ranging, display, biometric, camera, wearable electronics and fully custom module solutions.
PCB fabrication, component sourcing, SMT, packaging and testing under one roof.
Combined surface-mount and chip-on-board processes for high-precision, miniaturized products.
Flip-Chip, COC, COS and 2.5D packaging processes for next-generation modules.
Full-process SPI / AOI / X-Ray / ICT / FCT inspection with MES traceability.
Confirm product category, specs and target lead time.
BOM optimization, component selection and sample validation.
SMT / COB line scheduling and first-article confirmation.
Full SPI / AOI / X-Ray / FCT testing.
ESD-safe packaging and global logistics.
Share your product requirements and specs — we'll respond with an initial proposal within one business day.
